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Doctech is a pioneering company specializing in surface metal treatment technologies, chemical additives, and advanced materials for semiconductor packaging. We are committed to developing cutting-edge solutions that address the dynamic needs of the 3D IC packaging and electronics industries.
Key Responsibilities
Assist the research and development of electroplating solutions for surface metal treatments, focusing on advanced additive formulations.
Conduct in-depth material characterization and performance analysis of electroplated metals.
Collaborate with the R&D team to innovate and optimize formulations to enhance metal deposition quality, conductivity, and stability.
Design and execute experiments to test materials properties and develop novel methodologies for improved metal adhesion.
Qualifications
Bachelor degree or undergraduate in Chemistry, Electrical, Material Science Engineering, or a related field.
Experience in electrochemistry, particularly in the development of electroplating solutions will be a PLUS.
Experience in materials analysis techniques and other related testing methodologies will be a PLUS.
Laboratory skills, with experience in metal deposition and surface treatment technologies.
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